Product development requirements across aerospace, military, semiconductor, and other commercial industries demand reductions for weight and module sizes with increases in power densities and device performance.  The thermal challenges of additional heat generation have become a key barrier in continuing improvements and are an important concern for systems to function reliably, efficiently, and prevent premature failure.  Conventional methods of conduction and convection using larger mechanical heat sinks and fans are not always sufficient or practical to dissipate the heat, as they require extra space, add weight, and require additional power which can be counterproductive.